Submerging servers, for any enterprise application, in a single-phase immersion cooling solution produces the most efficient outcome. Immersion cooling is safe for all crucial components and is environmentally friendly, all while reducing CAPEX and OPEX.
Applications included:
Applications included:
High-frequency Trading
Hyperscale Computing
Rendering and Gaming
Supercomputer
Telecommunications
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G152-Z12
HPC Server - 1U UP Gen4 4 x GPU Server System
Form Factor1U
CPUAMD EPYC 7003
DIMM 插槽数量8
LAN 速度10Gb/s
LAN端口2
存储托架4 x 2.5" 托架
PSU双 2000W
Vi ew Detailof G152-Z12
S251-3O0
Intel Xeon Scalable UP Immersion Server System - 2U 26-Bay
Form Factor2U
CPU第二代 Intel Xeon Scalable 或 Intel Xeon Scalable
DIMM 插槽数量8
LAN 速度1Gb/s
LAN端口2
存储托架24 x 3.5" + 2 x 2.5" 托架
PSU双 1300W
Vi ew Detailof S251-3O0
H262-Z6B
HCI Server – AMD DP 2U 4 Nodes Immersion Server Gen4 NVMe
Form Factor2U 4节点
CPUAMD EPYC 7002 或 AMD EPYC 7003
DIMM 插槽数量64
LAN 速度1Gb/s
LAN端口8
存储托架8 x 2.5" 托架
PSU双 3000W
Vi ew DetailH262-Z6B
HPC Server - 2U DP 16 x Gen4 GPU Immersion Server (Broadcom solution)
Form Factor2U
CPUAMD EPYC 7002 或 AMD EPYC 7003
DIMM 插槽数量16
LAN 速度10Gb/s
LAN端口2
存储托架8 x 2.5" 托架
PSUDual 2200W
HPC Server - 2U DP 8 x Gen4 GPU Immersion Server
Form Factor2U
CPUAMD EPYC 7002 或 AMD EPYC 7003
DIMM 插槽数量16
LAN 速度1Gb/s
LAN端口2
存储托架8 x 2.5" 托架
PSUDual 2200W
HPC Server - 2U 8 x GPU Immersion Server
Form Factor2U
CPU第三代Intel Xeon Scalable
DIMM 插槽数量24
LAN 速度10Gb/s
LAN端口2
存储托架8 x 2.5" 托架
PSU双 3000W
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