Efficient cooling & heat dissipation for performance demanding servers are possible with direct to chip liquid cooling. Liquid cooling ensures peak system performance and reliability while encouraging denser compute. DLC extends cooling to CPU, GPU, RAM, and NIC.
Applications included:
Applications included:
High-frequency Trading
Hyperscale Computing
Rendering and Gaming
Supercomputer
Telecommunications
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HPC Server – 4th Gen. Intel Xeon Scalable Server DP 8 x Gen4 NVMe/SATA/SAS Liquid Cooling Solution
Form Factor2U 4节点
CPU第四代Intel Xeon Scalable
DIMM 插槽数量64
存储托架8 x 2.5" b ays
PSU双 3000W
HPC Server – 4th Gen. Intel Xeon Scalable Server DP 24 x Gen4 NVMe/SATA/SAS Liquid Cooling Solution
Form Factor2U 4节点
CPU第四代Intel Xeon Scalable
DIMM 插槽数量64
存储托架24 x 2.5" bays
PSU双 3000W
All SKUsH263
G492-ZL2
HPC Server - 4U DP SXM4 A100 8 GPU Server Liquid Cooling Solution
Form Factor4U
CPUAMD EPYC 7002 或 AMD EPYC 7003
DIMM 插槽数量32
LAN 速度10Gb/s
LAN端口2
存储托架6 x 2.5" bays
PSUQuad 3000W
查看详细信息G492-ZL2
G262-ZL0
HPC Server - 2U DP SXM4 A100 4 GPU Server Liquid Cooling Solution
Form Factor2U
CPUAMD EPYC 7002 或 AMD EPYC 7003
DIMM 插槽数量16
LAN 速度1Gb/s
LAN端口2
存储托架4 x 2.5" 托架
PSU双 3000W
查看详细信息G262-ZL0
HPC Server – AMD DP 2U 4 Nodes Server Gen4 NVMe Liquid Cooling Solution
Form Factor2U 4节点
CPUAMD EPYC 7002 或 AMD EPYC 7003
DIMM 插槽数量64
LAN 速度1Gb/s
LAN端口8
存储托架24 x 2.5" bays
PSU双 2200W
HPC Server – AMD DP 2U 4 Nodes Server Gen4 NVMe Liquid Cooling Solution
Form Factor2U 4节点
CPUAMD EPYC 7002 或 AMD EPYC 7003
DIMM 插槽数量64
LAN 速度1Gb/s
LAN端口8
存储托架24 x 2.5" bays
PSU双 2200W
All SKUsH262
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